Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

ABSTRACT

Microelectronic workpieces that have bump sites over bond-pads and methods of fabricating such bump sites. One embodiment of such a workpiece, for example, includes a substrate having a plurality of microelectronic dies comprising integrated circuitry and bond-pads, such as copper bond-pads, electrically coupled to the integrated circuitry. The workpiece further includes (a) a dielectric structure having a plurality of openings with sidewalls projecting from corresponding bond-pads, and (b) a plurality of caps over corresponding bond-pads. The individual caps can include a discrete portion of a barrier layer attached to the bond-pads and the sidewalls of the openings, and a discrete portion of a cap layer on the barrier layer. The caps are electrically isolated from each other and self-aligned with corresponding bond-pads without forming a mask layer over the cap layer.

TECHNICAL FIELD

The present invention relates to interconnect structures with bond-pads,such as copper bond-pads, and methods of forming bump sites onbond-pads.

BACKGROUND

Semiconductor devices and other types of microelectronic devices have adie attached to a ceramic chip carrier, organic printed circuit board,lead frame, or other type of interposing structure. The microelectronicdies can be attached to interposing structures using Direct Chip Attach(DCA), flip-chip bonding, or wire-bonding to electrically connect theintegrated circuitry in the dies to the wiring of the interposingstructures. In typical DCA or flip-chip methods, very small bumps orballs of a conductive material (e.g., solder) are deposited onto thecontacts of a die. The bumps are then connected to correspondingterminals on an interposing structure.

Copper is widely used for the wiring in semiconductor devices. Forexample, the wiring in the integrated circuitry of many high performancedevices is composed of copper. The bond-pads of many microelectronicdies are also made from copper. One problem of copper bond-pads,however, is that copper easily oxidizes and corrodes in the presence ofoxygen and water. As a result, copper bond-pads must be protected toprevent oxidation and/or corrosion that could possibly impair or destroythe device.

FIG. 1 is a cross-sectional view illustrating a portion of amicroelectronic die 10 having substrate 11 with a copper bond-pad 20.The die 10 in FIG. 1 further includes passivation layers including afirst dielectric layer 32 (e.g., silicon dioxide), a second dielectriclayer 34 (e.g., silicon nitride), and a third dielectric layer 36 (e.g.,polyimide). The die 10 further includes a cap 40 having a barrier layer42 and a metal layer 44 over the barrier layer 42. The cap 40 is formedby constructing a first mask over the first and second dielectric layers32 and 34, and etching holes through the first and second dielectriclayers 32 and 34 over the bond-pad 20. The barrier layer 42 and themetal layer 44 are then deposited onto the workpiece 10. The process offorming the cap 40 further includes constructing a second mask on top ofthe metal layer 44 from a resist 50, developing the resist 50 to exposethe areas of the metal layer 44 over the upper portions of the thirddielectric layer 36, and then etching the metal layer 44 and the barrierlayer 42 down to the third dielectric layer 36 using a reactive ionetch. The resist 50 is subsequently stripped from the workpiece 10 toleave the cap 40 over the copper bond-pad 20.

One problem with the copper interconnect structure illustrated in FIG. 1is that it is relatively expensive to manufacture because this processrequires a first mask to form the openings over the bond-pad 20 and asecond mask to form the pattern of resist 50 over the metal layer 44.Masks are expensive to construct because they require very expensivephotolithography equipment to achieve the required tolerances insemiconductor devices. This process is also expensive because it uses acostly reactive ion etch to remove portions of the metal layer 44 andthe barrier layer 42. This process is even further expensive because theresist 50 pools over the bond-pad 20 and is time consuming to remove.

FIG. 2 is a cross-sectional view illustrating a portion of anotherembodiment of a microelectronic die 100 having a cap to protect a copperbond-pad. The die 100 illustrated in FIG. 2 is similar to the die 10illustrated in FIG. 1, and thus like reference numbers refer to likecomponents in both of these figures. The die 100 illustrated in FIG. 2includes a cap 140 plated onto the bond-pad 20. The cap 140 isfabricated by constructing the first mask and forming a hole through thefirst and second dielectric layers 32 and 34 over the bond-pad 20. Afterforming the hole over the bond-pad 20, the cap 140 is plated onto thebond-pad 20 using a series of different plating cycles. For example, apalladium layer 142 can be plated directly onto the bond-pad 20 using aplating process. The palladium layer 142 provides a seed layer ornucleation layer for plating a nickel layer 144 onto the palladium layer142 using another plating process. In some embodiments, a silver layer146 can be plated onto the palladium layer 142 before depositing thenickel layer 144, and/or a gold layer 148 can be deposited onto thenickel layer 144.

One problem with the cap 140 illustrated in FIG. 2 is that the nickelinitially plates onto one of the underlying metal layers and thencontinues to plate upon itself. The nickel, however, does not bond tothe sidewalls of the opening through the dielectric layers such thatoxygen and moisture can migrate along the interface between the nickeland the dielectric layers 32, 34 and 36. Therefore, the contact 140 doesnot sufficiently protect the copper bond-pad 20 from oxidation andcorrosion.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a microelectronic device having acopper bond-pad in accordance with one aspect of the prior art.

FIG. 2 is a cross-sectional view of a microelectronic device having acopper bond-pad in accordance with another aspect of the prior art.

FIG. 3 is a cross-sectional view illustrating a portion of amicroelectronic workpiece having a plurality of copper bond-pads andprotective caps on the copper bond-pads in accordance with an embodimentof the invention.

FIGS. 4A-4D are cross-sectional views illustrating stages of a processfor fabricating a conductive cap over a copper bond-pad in accordancewith one embodiment of the invention.

FIGS. 5A-5C are cross-sectional views illustrating stages of a processfor fabricating a conductive cap over a copper bond-pad in accordancewith another embodiment of the invention.

DETAILED DESCRIPTION

1. Overview

Several aspects of the present invention are directed toward formingprotective caps on bond-pads, such as bond-pads composed of copper,silver, gold or other suitable conductive materials. The protective capsprovide sites to which conductive bumps, wire-bonds, metallization ofredistribution layers, or balls may be attached in the manufacturing ofmicroelectronic devices. One embodiment of a method for fabricating suchbumps sites comprises providing a microelectronic workpiece having aplurality of dies that include integrated circuitry and bond-padselectrically coupled to the integrated circuitry. This embodimentfurther includes creating a passivation structure on the workpiece,forming openings in the passivation structure to expose portions of thebond-pads, and depositing an external metal layer over the passivationstructure and the exposed portions of the bond-pads. The external metallayer generally has a thickness such that the openings are notcompletely filled by the metal layer. The process further includesplanarizing the workpiece to an endpoint in the passivation structure.The planarization stage comprises placing the workpiece against aplanarizing medium, and moving the workpiece and/or the planarizingmedium relative to each other in a manner that removes portions of theexternal metal layer and the barrier layer from the passivationstructure. As a result, the planarizing procedure electrically isolatesremaining portions of the metal layer in the openings formed in thepassivation structure to construct self-aligned protective caps over thebond-pads.

Another embodiment and method for fabricating bump sites on copperbond-pads includes providing a microelectronic workpiece having aplurality of dies that include integrated circuitry and bond-padselectrically coupled to the integrated circuitry. This embodimentfurther includes constructing a dielectric structure including openingsthrough the dielectric structure. The openings have sidewalls arrangedto at least partially expose the bond-pads and shoulders projectingtransversely relative to the sidewalls. This embodiment further includesdepositing a conductive layer over the dielectric structure and theexposed portions of the bond-pads such that the conductive layer hassteps seated with the shoulders in the openings. The upper portions ofthe conductive layer are removed from the top of the dielectricstructure to form self-aligned caps over the copper bond-pads. Forexample, the upper portions of the conductive layer can be removed fromthe dielectric structure by placing the workpiece against a planarizingmedium, and moving the workpiece and/or the planarizing medium relativeto each other. This process can optionally include forming anintermediate layer on the dielectric structure and the exposed portionsof the bond-pads before depositing the conductive layer, and thendepositing the conductive layer onto the intermediate layer. Theintermediate layer, for example, can be (a) a barrier layer thatprevents diffusion or migration of material between the bond-pads andthe conductive layer, and/or (b) an adhesive layer that provides goodadhesion to the dielectric structure and/or the bond-pads. Theconductive layer can be aluminum, nickel or other suitable metals.

Another embodiment of a method for forming bump sites on copperbond-pads includes providing a microelectronic workpiece having aplurality of dies that include integrated circuitry and copper bond-padselectrically coupled to the integrated circuitry. This method furtherincludes constructing a dielectric structure on the workpiece to haveopenings arranged in a pattern that at least partially exposesindividual bond-pads. This method continues by forming a barrier layeron the dielectric structure and the exposed portions of the bond-pads,depositing an aluminum layer on the barrier layer, and coating thealuminum layer with a sacrificial material. The bump sites are furtherformed by removing upper portions of the sacrificial material, thealuminum layer, and the barrier layer using a mechanical orchemical-mechanical planarization process. The remaining portions of thesacrificial material can then be removed from the workpiece to exposethe portions of the aluminum layer on the copper bond-pads.

Still another method for fabricating bump sites on bond-pads inaccordance with the invention comprises providing a microelectronicworkpiece having a plurality of dies that include integrated circuitryand bond-pads electrically coupled to the integrated circuitry. Thisembodiment further includes constructing a dielectric structure on theworkpiece to have openings aligned with corresponding bond-pads anddepositing a conductive cap layer over the dielectric structure and thebond-pads. The cap layer has a thickness less than that of thedielectric structure such that the openings in the dielectric structureare not completely filled by the cap layer. This method further includesremoving portions of the cap layer from the workpiece without forming amask over the cap layer to construct caps comprising discrete portionsof at least the cap layer. The caps are self-aligned with correspondingcopper bond-pads.

Another aspect of the invention is directed toward microelectronicworkpieces that have bump sites over copper bond-pads. One embodiment ofsuch a workpiece, for example, includes a substrate having a pluralityof microelectronic dies comprising integrated circuitry and bond-padselectrically coupled to the integrated circuitry. The workpiece furtherincludes (a) a dielectric structure having a plurality of openings withsidewalls projecting from corresponding bond-pads, and (b) a pluralityof caps over corresponding bond-pads. The individual caps include adiscrete portion of a conductive cap layer. The caps are electricallyisolated from each other and self-aligned with corresponding bond-padswithout forming a mask layer over the cap layer. The caps typically havea thickness less than that of the dielectric structure such that theopenings in the dielectric structure are not completely filled by thecaps.

Another embodiment of a microelectronic workpiece in accordance with theinvention comprises a substrate having a plurality of microelectronicdies including integrated circuitry and bond-pads electrically coupledto the integrated circuitry. This embodiment further includes adielectric structure on the workpiece and a plurality of conductive capsover the bond-pads. The dielectric structure has a planarized uppersurface and a plurality of openings with sidewalls projecting fromcorresponding copper bond-pads. The individual conductive caps have aconductive layer in the openings. In one embodiment, the caps caninclude (a) a first layer attached to the bond-pads and the sidewalls ofthe openings, and (b) a second layer on the first layer. The secondlayer is typically aluminum or another suitably conductive material. Thecaps further include a planarized portion extending from the planarizedupper surface of the dielectric structure. The workpiece can furtherinclude a plurality of external electrical connectors, such asconductive balls or wire-bonds, attached to the caps.

Another embodiment of a microelectronic workpiece in accordance with theinvention includes a substrate having a plurality of microelectronicdies including integrated circuitry and copper bond-pads electricallycoupled to the integrated circuitry. This embodiment further includes adielectric structure on the workpiece and a plurality of conductive capselectrically isolated from each other and positioned over correspondingbond-pads. The dielectric structure in this embodiment includes a firstdielectric layer on the workpiece, a second dielectric layer on thefirst dielectric layer, and a third dielectric layer on the seconddielectric layer. The dielectric structure can further include aplurality of openings with sidewalls that are aligned with correspondingcopper bond-pads. The individual openings have a lateral shoulderbetween the second and third dielectric layers or at another suitablelocation along the sidewalls. The conductive caps are positioned incorresponding openings over the bond-pads, and individual caps have astep engaged with a shoulder of a corresponding opening.

Several embodiments of the invention are described in the followingsections with reference to copper bond-pads on a semiconductor device,but the methods and structures described below can be used for othertypes of microelectronic devices. The bond-pads, moreover, are notlimited to copper bond-pads, but alternatively may be silver, gold orother suitable materials. Furthermore, other embodiments of theinvention can have different configurations or components than thosedescribed herein. Several embodiments of the invention, therefore, mayhave additional elements or may not have some of the elements describedbelow with reference to FIGS. 3-5C.

2. Embodiments of Self-Aligned Caps on Copper Bond-Pads

FIG. 3 is a cross-sectional view illustrating a portion of amicroelectronic workpiece 300 including a plurality of protective capson bond-pads to provide contact sites for solder balls, wire-bonds,metallization of redistribution layers, or other externally exposedconductive connectors. The microelectronic workpiece 300 includes asubstrate 310 having a plurality of dies 320 formed in and/or on thesubstrate 310. The dies 320 include integrated circuitry 330 andbond-pads 340 electrically coupled to the integrated circuitry 330. Thebond-pads 340 are typically copper pads, but the bond-pads 340 can besilver pads, gold pads, or other suitably conductive pads. The workpiece300 further includes a dielectric structure 350 having a plurality ofopenings 352 arranged in a pattern over the bond-pads 340. The openings352, more specifically, are configured to expose at least a portion ofindividual bond-pads 340 that are to be coupled to an external device.The workpiece further includes a plurality of caps 360 that cover thebond-pads 340 and are attached to sidewalls of the openings 352. Asexplained in more detail below, the caps 360 are self-aligned withcorresponding bond-pads 340 such that a separate mask is not used toelectrically isolate the caps 360 in the openings 352. Compared to theconventional structures illustrated in FIGS. 1 and 2, the caps 360 areexpected to (a) be much less expensive to fabricate, and (b) providebetter protection against oxygen and moisture.

FIGS. 4A-4D are cross-sectional views illustrating the workpiece 300 atsequential stages of a process for fabricating one embodiment of thecaps 360 shown in FIG. 3. Like reference numbers refer to likecomponents in FIGS. 3-4D. FIG. 4A illustrates an early stage of thisprocess in which the dielectric structure 350 has been deposited ontothe substrate 310, but the bond-pad 340 has not yet been exposed throughthe dielectric structure 350. In this embodiment, the dielectricstructure 350 includes a first dielectric layer 410, a second dielectriclayer 412 on the first dielectric layer 410, and a third dielectriclayer 414 on the second dielectric layer 412. The first dielectric layer410 can be silicon dioxide and the second dielectric layer 412 can besilicon nitride. The first and second dielectric layers 410 and 412 canhave a combined thickness of approximately 0.5 μm to 4 μm, and theselayers typically have a total thickness of approximately 1 μm to 1.5 μm.The third dielectric layer 414 can be a polymer or other suitabledielectric material for forming a permanent mask on the seconddielectric layer 412. The third dielectric layer 414, for example, canbe a photo-active material deposited to a thickness of approximately2-10 microns. One specific embodiment of the third dielectric layer 414is a 4 micron thick layer of polybenzoxazole (PBO). As explained in moredetail below, the third dielectric layer 414 is configured to inhibitdishing over the bond-pad 340 in a subsequent planarization procedure.The third dielectric layer 414, more specifically, is sufficiently thickto protect the bond-pad 340 and any metal layers over the bond-pad 340from excessive erosion during a subsequent chemical-mechanicalplanarization stage. The workpiece 300 can further include a diffusionbarrier 415 between the copper bond-pad 340 and the dielectric structure350 to prevent copper from diffusing into the dielectric structure 350.In one embodiment, the diffusion barrier 415 is a 300 Å thick layer ofsilicon carbide. The dielectric layers 410, 412, 414 and 415 can all bedeposited using suitable chemical vapor deposition, sputtering, or otherknown processes for depositing these materials.

FIG. 4B illustrates a subsequent stage of the method in which an opening352 has been formed through the dielectric structure 350 to expose aportion of the bond-pad 340. The opening 352 has a sidewall 420 and ashoulder 422 along the sidewall 420. The shoulder 422 can be a lateralnotch or rim extending transversely with respect to the sidewall 420.The opening 352, for example, generally has a cross-sectional dimensionparallel to the top surface of the bond-pad 340 of approximately 20 μmto 120 μm, and more generally 40 μm to 100 μm. In one embodiment, thethird dielectric layer 414 is composed of PBO and the opening 352 isformed by exposing and developing the PBO to create a mask having a holealigned with the bond-pad 340. The portions of the second dielectriclayer 412, first dielectric layer 410 and the diffusion barrier 415 overthe bond-pad 340 are then etched to expose the upper surface of thebond-pad 340. After etching the opening 352, the workpiece 300 iscleaned using a light plasma clean-up. The plasma clean-up also erodesthe third dielectric layer 414 to further form the shoulder 422 at theinterface between the second dielectric layer 412 and the thirddielectric layer 414.

FIG. 4C illustrates the workpiece 300 at a subsequent stage after whichconductive materials for the cap have been deposited onto the workpiece.In one embodiment, the workpiece 300 includes a first conductive layer430 deposited onto the dielectric structure 350 and the bond-pad 340,and a second conductive layer 440 deposited onto the first conductivelayer 430. The first conductive layer 430, for example, can be anoptional intermediate layer that provides (a) a barrier to preventmigration or diffusion of materials between the bond-pad 340 and thesecond conductive layer 440, and/ or (b) adheres well to dielectricstructure 350 and the bond-pads 340. In the case of copper bond-pads,the first conductive layer 430 is typically a barrier/adhesion layerhaving a thickness of approximately 300 Å to 500 Å, and the secondconductive layer 440 is typically a metal layer having a thickness ofapproximately 5,000 Å to 30,000 Å. The first conductive layer 430 can becomposed of Ta, TaN, TiN, WN_(x), or other suitable materials thatprevent copper from diffusing into the dielectric structure 350 and/orthe second conductive layer 440. The second conductive layer 440 can bean aluminum layer having a thickness of approximately 8,000 Å to 20,000Å. The second conductive layer 440 can alternatively be nickel oranother suitable metal. In the case of a nickel second conductive layer440, the first conductive layer 430 in not needed because copper doesnot diffuse into nickel. The first and second conductive layers 430 and440 conform to the sidewall 420 and the shoulder 422. As a result, thefirst and second conductive layers 430 and 440 have a step 442 seatedwith the shoulder 422. The interface between the step 442 and theshoulder 422 provides a strong barrier to block oxygen and moisture fromreaching the bond-pad 340. The first and second conductive layers 430and 440 also have a combined thickness less than that of the dielectricstructure 350 such that these conductive layers do not completely fillthe opening 352 in the dielectric structure 350. In one embodiment, thecombined thickness of the first and second conductive layers 430 and 440is approximately 1 μm to 3 μm such that a significant void withoutconductive material exists in the opening 352 immediately afterdepositing the conductive layers.

FIG. 4D illustrates the workpiece 300 after a cap 460 has been formedover the bond-pad 340. The cap 460 is an embodiment of one of the caps360 shown in FIG. 3. The cap 460 is formed by planarizing the workpiece300 to remove the upper portions of the first and second conductivelayers 430 and 440 from the top surface of the third dielectric layer414. The workpiece 300 can be planarized by placing the workpiece 300against a planarizing medium (not shown), and moving the workpieceand/or the planarizing medium relative to each other. The planarizationprocess removes the upper portions of the first and second conductivelayers 430 and 440 from the top surface of the third dielectric layer414 without excessively eroding the portion of the first and secondconductive layers 430 and 440 over the bond-pad 340. The thirddielectric layer 414 protects the portion of the first and secondconductive layers 430 and 440 over the bond-pad 340 because therelatively large thickness of the third dielectric layer 414 preventsthe polishing pad from projecting into the opening to the extent that itcauses unacceptable “dishing” in the second conductive layer 440.Although no dishing is shown in the portion of the second conductivelayer 440 over the bond-pad 340, some dishing may be acceptable. Asshown in FIG. 4D, the third dielectric layer 414 has a planarized uppersurface 450 and the cap 460 has a planarized portion 462 that is anextension of the planarized upper surface 450. The planarizing processelectrically isolates the cap 460 on the bond-pad 340 without having toform a second mask over the second conductive layer 440. The cap 460,therefore, is self-aligned with the bond-pad 340.

One aspect of the cap 460 illustrated in FIG. 4D is it is expected to beless expensive to produce than the cap 40 illustrated and describedabove with reference to FIG. 1. The cap 460 is manufactured using only asingle mask to form the openings 352 through the dielectric structure350. The caps 460 are self-aligned with the bond-pads 340 because theplanarizing procedure described with reference to FIG. 4D removes theupper portions of the first and second conductive layers 430 and 440from the top surface of the dielectric structure 350 without using asecond mask. In contrast to the cap 460 illustrated in FIG. 4D, the cap40 illustrated in FIG. 1 requires a first mask to form the openingthrough the dielectric layers and a second mask to pattern the resist50. Moreover, the cap 40 illustrated in FIG. 1 requires an expensivereactive ion etch to remove the exposed portions of the conductivelayers, and the resist 50 must be stripped from the cap 40. The singleplanarizing process used to form the cap 460 is much less expensive thanforming a second mask on the workpiece, etching the metal layers using areactive ion etch, and cleaning the resist. Therefore, the cap 460illustrated in FIG. 4D is expected to be cost effective to produce.

The embodiment of the cap 460 illustrated in FIG. 4D is further expectedto provide exceptionally good protection of the copper bond-pad 40.First, the first conductive layer 430 bonds or otherwise adheres to thesidewall 420, and the second conductive layer 440 bonds to the firstconductive layer 430. Second, the length of the interface between thecap 460 and the dielectric structure 350 is relatively long. As aresult, oxygen and moisture are less likely to reach the surface of thecopper bond-pad 340. Third, the interface between the shoulder 422 andthe step 442 further inhibits air and moisture from reaching the copperbond-pad 340. The second conductive layer 440 typically has a highercoefficient of thermal expansion than the dielectric structure 350. As aresult, when the second conductive layer 440 cools after it has beendeposited, it contracts inwardly and downwardly to a greater extent thanthe dielectric structure 350 contracts such that the step 442 pressesdownward against the shoulder 422. The second conductive layer 440effectively forms a seal between the step 442 and the shoulder 422 tofurther inhibit oxygen, moisture or other contaminants from reaching thebond-pad 340.

Another aspect of the cap 460 is that the dielectric structure enablesthe use of chemical-mechanical planarization to remove the upperportions of the first and second conductive layers 430 and 440 without amask. Before the present invention, chemical-mechanical planarizationwas not thought to be a viable option for removing the upper portions ofthe first and second conductive layers 430 and 440 because the polishingpad would project into the openings and cause dishing in the caps. Theembodiment of the process illustrated in FIGS. 4A-4D enables the use ofchemical-mechanical planarization by configuring the dielectricstructure 350 to prevent or at least mitigate dishing of the secondconductive layer 440 in the region over the bond-pad 340. For example,one particular embodiment of the procedure illustrated in FIGS. 4A-4Dforms the third dielectric layer 414 to a thickness of approximately 4microns so that the planarizing pad does not “dish” into the secondconductive layer 440 to an unacceptable extent before the upper portionsof the first and second conductive layers 430 and 440 have been removedfrom the third dielectric layer 414.

FIGS. 5A-5C illustrate a method for forming a cap defining anotherembodiment of one of the caps 360 illustrated in FIG. 3. Like referencenumbers refer to like components in FIGS. 3-5C. FIG. 5A illustrates anearly stage of this embodiment in which the workpiece 300 has adielectric structure 505 including a first dielectric layer 510 and asecond dielectric layer 512. The first dielectric layer 510 can besilicon dioxide, and the second dielectric layer 512 can be siliconnitride. The workpiece 300 can further include a barrier layer 513between the copper bond-pad 340 and the dielectric structure 505 toprevent copper from diffusing into the dielectric structure 505. Thedielectric 505 further includes an opening 352 having a sidewall 520projecting from the bond-pad 340. The first and second dielectric layers510 and 512 can be deposited onto the substrate 310, and then theopening 352 can be etched through the first and second dielectric layers510 and 512 using a mask. The mask is then stripped from the workpiece300.

FIG. 5B illustrates the workpiece 300 at a subsequent stage of themethod. At this stage, the workpiece includes a first conductive layer530 deposited onto the second dielectric layer 512 and the bond-pad 340.The workpiece further includes a second conductive layer 540 depositedonto the first conductive layer 530, and a sacrificial material 550deposited onto the second conductive layer 540. The first conductivelayer 530 can be a barrier layer, the second conductive layer 540 can bealuminum or another suitable metal, and the sacrificial material 550 canbe a resist. The structure and compositions of the first and secondconductive layers 530 and 540 can be the same as the first and secondconductive layers 430 and 440 described above with reference to FIGS.4A-D.

FIG. 5C illustrates the workpiece 300 after the upper portions of thefirst and second conductive layers 530 and 540 have been removed using aplanarization process to form a cap 560 over the bond-pad 340. In thisembodiment, the upper portions of the first and second conductive layers530 and 540 are removed from the workpiece 300 by pressing the workpiece300 against a planarizing medium, and moving the workpiece and/or theplanarizing medium relative to each other in a chemical-mechanicalplanarization process. As a result, the second dielectric layer 512 hasa planarized surface 515 and the cap 560 has a planarized portion 562.

From the foregoing, it will be appreciated that specific embodiments ofthe invention have been described herein for purposes of illustration,but that various modifications may be made without deviating from thespirit and scope of the invention. For example, the planarizingprocesses described above with reference to FIGS. 4D and 5C can bepurely a mechanical process or a chemical-mechanical process. Thebond-pads, conductive layers and dielectric layers, moreover, can becomposed of different materials and/or have different thicknesses thanthose described above. Additionally, a redistribution structure can befabricated on top of the dielectric structure and caps such that themetallization in the redistribution structures is electrically coupledto the caps over the bond-pads. Accordingly, the invention is notlimited except as by the appended claims.

1. A method of forming bump sites on bond-pads in the manufacturing ofmicroelectronic devices, comprising: providing a microelectronicworkpiece having a plurality of dies, wherein individual dies includeintegrated circuitry and bond-pads electrically coupled to theintegrated circuitry; forming a passivation structure on the workpiece,wherein forming the passivation structure comprises depositing a firstdielectric over the workpiece, a second dielectric layer onto the firstdielectric layer, and a photo-active third dielectric layer onto thesecond dielectric layer; creating openings in the passivation structureto at least partially expose the bond-pads, wherein creating openings inthe passivation structure comprises developing the photo-active thirddielectric layer to form a mask having holes aligned with the bond-pads,etching using the mask through the first and second dielectric layers toform openings having sidewalls projecting from corresponding bond-pads,and forming shoulders in the openings that extend transversely to thesidewalls; depositing an intermediate layer onto the bond-pads and thepassivation structure; depositing an external metal layer over thepassivation structure and the bond-pads, wherein depositing an externalmetal layer comprises depositing an aluminum layer onto the intermediatelayer; and planarizing the workpiece by placing the workpiece against aplanarizing medium and moving the workpiece and/or the planarizingmedium relative to each other in a manner that removes portions of theexternal metal layer from the passivation structure, wherein planarizingthe workpiece comprises chemical-mechanical planarization of portions ofthe intermediate layer and the external metal layer from a top surfaceof the third dielectric layer to leave self-aligned caps over thebond-pads.
 2. The method of claim 1 wherein depositing the metal layercomprises depositing the metal layer to a thickness less than athickness of the passivation structure such that the metal layer doesnot completely fill the openings in the passivation structure beforeplanarizing the workpiece.
 3. The method of claim 1 wherein thebond-pads are copper and the intermediate layer is a barrier layer thatinhibits copper from diffusing into the external metal layer.
 4. Themethod of claim 1 wherein the third dielectric layer comprises PBO. 5.The method of claim 1 wherein the intermediate layer is a barrier layercomprising tantalum, titanium and/or tungsten.
 6. The method of claim 1wherein the method further comprises depositing a sacrificial materialonto the metal layer before planarizing the workpiece, and strippingremaining portions of the sacrificial material after planarizing theworkpiece.
 7. The method of claim 1 wherein the passivation structurehas a thickness configured to prevent dishing into portions of theintermediate layer over the bond-pads during the planarizing stage. 8.The method of claim 7 wherein the third dielectric layer has a thicknessof approximately 4 μm.
 9. A method of forming bump sites on bond-pads inthe manufacturing of microelectronic devices, comprising: providing amicroelectronic workpiece having a plurality of dies, wherein individualdies include integrated circuitry and bond-pads electrically coupled tothe integrated circuitry; constructing a dielectric structure such thatthe dielectric structure has openings aligned with correspondingbond-pads and the openings have (a) sidewalls arranged to at leastpartially expose the bond-pads and (b) shoulders projecting transverselyrelative to the sidewalls, wherein constructing the dielectric structurecomprises forming a passivation structure by depositing a firstdielectric layer over the workpiece, depositing a second dielectriclayer onto the first dielectric layer, depositing a photo-active thirddielectric layer onto the second dielectric layer, developing the thirddielectric layer to form a mask having holes aligned with the bond-pads,and etching using the mask through the first and second dielectriclayers to form the openings, wherein the sidewalls of the openingsextend through the first, second and third dielectric layers and projectfrom the bond-pads; depositing a metal layer over the dielectricstructure and the bond-pads, wherein metal layer has steps seated withthe shoulders in the openings; and removing portions of the metal layerfrom upper portions of the dielectric structure to form self-alignedcaps over the bond-pads by placing the workpiece against a planarizingmedium and moving the workpiece and/or the planarizing medium relativeto each other.
 10. The method of claim 9 further comprising forming theshoulders by eroding the third dielectric layer such that an uppersurface of the second dielectric layer projects laterally inward intothe openings beyond a lower surface of the third dielectric layer. 11.The method of claim 9 wherein the third dielectric layer comprises PBO.12. The method of claim 9 wherein the third dielectric layer has athickness configured to prevent dishing through the portions of themetal layer over the bond-pads during the planarization stage.
 13. Themethod of claim 9, further comprising (a) depositing an intermediatelayer onto the dielectric structure before depositing the metal layer,and (b) removing portions of both the metal layer and the intermediatelayer from the upper portions of the dielectric structure by planarizingthe workpiece to form the self-aligned caps having a discrete portion ofthe barrier layer and a discrete portion of the metal layer.
 14. Themethod of claim 13 wherein the bond-pads comprise one or more of copper,silver and gold.
 15. The method of claim 9 wherein removing portions ofthe metal layer from upper portions of the dielectric structurecomprises exposing a surface of the third dielectric layer.
 16. A methodof forming bump sites on copper bond-pads in the manufacturing ofmicroelectronic devices, comprising: providing a microelectronicworkpiece having a plurality of dies, wherein individual dies includeintegrated circuitry and copper bond-pads electrically coupled to theintegrated circuitry; constructing a dielectric structure on theworkpiece such that the dielectric structure has openings arranged to atleast partially expose individual copper bond-pads, wherein constructingthe dielectric structure comprises forming a passivation structure bydepositing a first dielectric layer over the workpiece, depositing asecond dielectric layer onto the first dielectric layer, depositing aphoto-active third dielectric layer onto the second dielectric layer,developing the third dielectric layer to form a mask having holesaligned with the bond-pads, and etching using the mask through the firstand second dielectric layers to form the openings, wherein sidewalls ofthe openings extend through the first, second and third dielectriclayers and project from the bond-pads; forming a barrier layer on thedielectric structure and the exposed portions of the bond-pads;depositing an aluminum layer onto the barrier layer; coating thealuminum layer with a sacrificial material; removing portions of thesacrificial material, the aluminum layer, and the barrier layer fromupper portions of the dielectric structure by placing the workpieceagainst a planarizing medium and moving the workpiece and/or theplanarizing medium relative to each other; and removing remainingportions of the sacrificial material from the workpiece.
 17. The methodof claim 16 wherein removing portions of the sacrificial material, thealuminum layer, and the barrier layer comprises exposing a surface ofthe third dielectric layer.
 18. A method of forming bump sites onbond-pads in the manufacturing of microelectronic devices, comprising:providing a microelectronic workpiece having a plurality of dies,wherein individual dies include integrated circuitry and bond-padselectrically coupled to the integrated circuitry; constructing adielectric structure on the workpiece such that the dielectric structurehas openings aligned with corresponding bond-pads, wherein constructingthe dielectric structure comprises forming a passivation structure bydepositing a first dielectric layer over the workpiece, depositing asecond dielectric layer onto the first dielectric layer, depositing aphoto-active third dielectric layer onto the second dielectric layer,developing the third dielectric layer to form a mask having holesaligned with the bond-pads, and etching using the mask through the firstand second dielectric layers to form the openings, wherein the openingshave sidewalls that extend through the first, second and thirddielectric layers and project from the bond-pads; depositing aconductive cap layer over the dielectric structure and the bond-pads;removing portions of the cap layer from the workpiece without forming amask over the cap layer to form caps comprising discrete portions of thecap layer that are self-aligned with corresponding copper bond-pads. 19.The method of claim 18 further comprising forming shoulders in theopenings by eroding the third dielectric layer such that an uppersurface of the second dielectric layer projects laterally inward intothe openings beyond a lower surface of the third dielectric layer. 20.The method of claim 19, further comprising forming a conductive barrierlayer over the dielectric structure by depositing a diffusion barriermaterial onto the bond-pads and the sidewalls of the openings, andwherein: depositing a cap layer comprises depositing an aluminum layeronto the diffusion barrier material, wherein the aluminum layer and thediffusion barrier material have steps seated with the shoulders in theopenings; and removing the portions of the cap layer and the barrierlayer without forming a mask comprises chemical-mechanical planarizationof portions of the aluminum layer and the diffusion barrier materialfrom a top surface of the third dielectric layer to leave self-alignedcaps over the bond-pads.
 21. The method of claim 18 wherein removing theportions of the cap layer without forming a mask comprises planarizingthe workpiece using a chemical-mechanical planarization process.
 22. Themethod of claim 21 wherein removing the portions of the cap layerwithout forming a mask further comprises exposing a surface of the thirddielectric layer.
 23. The method of claim 18 wherein the method furthercomprises forming a conductive barrier layer over the dielectricstructure by depositing a diffusion barrier material onto the bond-padsand the sidewalls of the openings, depositing a sacrificial materialonto the cap layer before planarizing the workpiece, and strippingremaining portions of the sacrificial material after planarizing theworkpiece, and wherein: depositing a cap layer comprises depositing analuminum layer onto the diffusion barrier material; and removing theportions of the cap layer and the barrier layer without forming a maskcomprises chemical-mechanical planarization of portions of the aluminumlayer and the diffusion barrier material from a top surface of thesecond dielectric layer to leave self-aligned caps over the bond-padsbefore stripping the remaining portions of sacrificial material from theworkpiece.